Ceramic Cavity Package

Ceramic pin grid array packages cpga cpgas are typically a square ceramic multilayer package with an array of pins brazed onto either the front side of the package cavity down or on the backside of the package cavity up.

Ceramic cavity package.

Air cavity type hermetic package close thermal expansion matching provides superior mechanical elasticity and less mechanical stress with silicon mems chips miniaturized high density surface mountable package incorporating multi layer ceramic technology. Available in larger sizes up to a cavity of 16 5 mm x 6 1 mm ni780 header unmetallized frames enable shorter lead times and reduce manufacturing complexity. These ceramic packages are suitable for use in sensors due to the high modulus of elasticity and low coefficient of thermal expansion of ceramic materials. Packages are available in surface mount designs as well as bolt down versions in dozens of open tooled designs.

Kyocera provides miniaturized surface mount ceramic packages with cavity structures available on both top and bottom. Hermetic or vacuum sealing is typically applied to ensure device quality. Cupack packages unique design with very low thermal resistance. Ca pack packages convenient pre assembled ceramic package.

Ceramic air cavity packages proven performance for wireless applications.